SinkPAD-II™ LED assemblies feature second-generation technology that minimizes thermal resistance by eliminating the dielectric layer so that the LED thermal pad is soldered directly to the aluminum base.
Eliminating the dielectric layer creates a direct thermal path between the LED thermal pad and the heatsink which translates into:
- Increased LED life
- Higher lumens output
- Improved color rendering and stability
- Reduced cooling requirements
- Better overall reliability
