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SinkPAD-II LED assemblies feature second-generation technology that minimizes thermal resistance by eliminating the dielectric layer so that the LED thermal pad is soldered directly to the aluminum base.
SinkPAD-II high performance LED assemblies
Eliminating the dielectric layer creates a direct thermal path between the LED thermal pad and the heatsink which translates into:
  • Increased LED life
  • Higher lumens output
  • Improved color rendering and stability
  • Reduced cooling requirements
  • Better overall reliability
SinkPAD-II Thermal Test Comparison
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